This paper proposes a circuit model for lossy multiconductor transmission lines (MTLs) suitable for implementation in modern SPICE simulators, as well as in any simulator supporting differential operators. The model includes the effects of a uniform or nonuniform disturbing field illuminating the line and is especially devised for the transient simulation of electrically long wideband interconnects with frequency dependent per-unit-length parameters. The MTL is characterized by its transient matched scattering responses, which are computed including both dc and skin losses by means of a specific algorithm for the inversion of the Laplace transform. The line characteristics are then represented in terms of differential operators and ideal delays to improve the numerical efficiency and to simplify the coding of the model in existing simulators. The model can be successfully applied to many kinds of interconnects ranging from micrometric high-resistivity metallizations to low-loss PCBs and cables, and can be considered a practical extension of the widely appreciated lossless MTL SPICE model, which maintains the simplicity and efficiency

Analysis of crosstalk and field coupling to lossy MTL's in a SPICE environment / Maio, Ivano Adolfo; Canavero, Flavio; Dilecce, B.. - In: IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY. - ISSN 0018-9375. - STAMPA. - 38:3(1996), pp. 221-229. [10.1109/15.536050]

Analysis of crosstalk and field coupling to lossy MTL's in a SPICE environment

MAIO, Ivano Adolfo;CANAVERO, Flavio;
1996

Abstract

This paper proposes a circuit model for lossy multiconductor transmission lines (MTLs) suitable for implementation in modern SPICE simulators, as well as in any simulator supporting differential operators. The model includes the effects of a uniform or nonuniform disturbing field illuminating the line and is especially devised for the transient simulation of electrically long wideband interconnects with frequency dependent per-unit-length parameters. The MTL is characterized by its transient matched scattering responses, which are computed including both dc and skin losses by means of a specific algorithm for the inversion of the Laplace transform. The line characteristics are then represented in terms of differential operators and ideal delays to improve the numerical efficiency and to simplify the coding of the model in existing simulators. The model can be successfully applied to many kinds of interconnects ranging from micrometric high-resistivity metallizations to low-loss PCBs and cables, and can be considered a practical extension of the widely appreciated lossless MTL SPICE model, which maintains the simplicity and efficiency
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Utilizza questo identificativo per citare o creare un link a questo documento: https://hdl.handle.net/11583/1398458
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