Pubblicazioni il cui periodico è "IEEE TRANSACTIONS ON COMPONENTS, PACKAGING, AND MANUFACTURING TECHNOLOGY"

Livello precedente
Esporta come [feed] Atom [feed] DataCiteXML [feed] RSS 1.0 [feed] RSS 2.0
Numero di pubblicazioni : 18.

Articolo di rivista Becker, Wiren Dale; Grivet-Talocia, Stefano (2017)
Foreword: Special Section on Addressing Signal and Power Integrity in Future Generation Systems—Part 2: Modeling Considerations. In: IEEE TRANSACTIONS ON COMPONENTS, PACKAGING, AND MANUFACTURING TECHNOLOGY, vol. 7 n. 5, pp. 651-652. - ISSN 2156-3950
Web of Science: 0 - Scopus: 0
[img]
Preview
[img]

Articolo di rivista Becker, Wiren Dale; Grivet-Talocia, Stefano (2017)
Foreword: Special Section on Addressing Signal and Power Integrity in Future Generation Systems—Part I: Technology and Design Considerations. In: IEEE TRANSACTIONS ON COMPONENTS, PACKAGING, AND MANUFACTURING TECHNOLOGY, vol. 7 n. 4, pp. 475-476. - ISSN 2156-3950
Web of Science: 0 - Scopus: 0
[img]
Preview
[img]

Articolo di rivista Grivet-Talocia, Stefano (2017)
A Perturbation Scheme for Passivity Verification and Enforcement of Parameterized Macromodels. In: IEEE TRANSACTIONS ON COMPONENTS, PACKAGING, AND MANUFACTURING TECHNOLOGY, vol. 7 n. 11, pp. 1869-1881. - ISSN 2156-3950
Scopus: 0
[img]
Preview
[img]

Articolo di rivista Signorini, Gianni; Siviero, Claudio; Grivet-Talocia, Stefano; Stievano, Igor S. (2016)
Macromodeling of I/O Buffers via Compressed Tensor Representations and Rational Approximations. In: IEEE TRANSACTIONS ON COMPONENTS, PACKAGING, AND MANUFACTURING TECHNOLOGY, vol. 6 n. 10, pp. 1522-1534. - ISSN 2156-3950
Web of Science: 0 - Scopus: 0
[img] [img]
Preview

Articolo di rivista S.B. Olivadese; G. Signorini; S. Grivet-Talocia; P. Brenner (2015)
Parameterized and DC-Compliant Small-Signal Macromodels of RF Circuit Blocks. In: IEEE TRANSACTIONS ON COMPONENTS, PACKAGING, AND MANUFACTURING TECHNOLOGY, vol. 5 n. 4, pp. 508-522. - ISSN 2156-3950
Web of Science: 4 - Scopus: 2
[img]
Preview
[img]

Articolo di rivista Grivet-Talocia S.; Signorini G.; Olivadese S.B.; Siviero C.; Brenner P. (2015)
Thermal Noise Compliant Synthesis of Linear Lumped Macromodels. In: IEEE TRANSACTIONS ON COMPONENTS, PACKAGING, AND MANUFACTURING TECHNOLOGY, vol. 5 n. 1, pp. 75-85. - ISSN 2156-3950
Web of Science: 2 - Scopus: 1
[img] [img]
Preview

Articolo di rivista Olivadese S.B.; Grivet-Talocia S.; Siviero C.; Kaller D. (2014)
Macromodel-Based Iterative Solvers for Simulation of High-Speed Links With Nonlinear Terminations. In: IEEE TRANSACTIONS ON COMPONENTS, PACKAGING, AND MANUFACTURING TECHNOLOGY, vol. 4 n. 11, pp. 1847-1861. - ISSN 2156-3950
Web of Science: 2 - Scopus: 2
[img]
Preview
[img]

Articolo di rivista Chinea A.; Grivet-Talocia S.; Olivadese S.B.;Gobbato L. (2013)
High-Performance Passive Macromodeling Algorithms for Parallel Computing Platforms. In: IEEE TRANSACTIONS ON COMPONENTS, PACKAGING, AND MANUFACTURING TECHNOLOGY, vol. 3 n. 7, pp. 1188-1203. - ISSN 2156-3950
Web of Science: 4 - Scopus: 4
[img] [img]
Preview

Articolo di rivista Manfredi P.; Vande Ginste D.; De Zutter D.; Canavero F.G. (2013)
Uncertainty Assessment of Lossy and Dispersive Lines in SPICE-Type Environments. In: IEEE TRANSACTIONS ON COMPONENTS, PACKAGING, AND MANUFACTURING TECHNOLOGY, vol. 3 n. 7, pp. 1252-1258. - ISSN 2156-3950 [Disponibilità ristretta]
Web of Science: 22 - Scopus: 23
[img]

Articolo di rivista Biondi A.; Vande Ginste D.; De Zutter D.; Manfredi P.; Canavero F.G. (2013)
Variability Analysis of Interconnects Terminated by General Nonlinear Loads. In: IEEE TRANSACTIONS ON COMPONENTS, PACKAGING, AND MANUFACTURING TECHNOLOGY, vol. 3 n. 7, pp. 1244-1251. - ISSN 2156-3950 [Disponibilità ristretta]
Web of Science: 25 - Scopus: 24
[img]

Articolo di rivista S.B. Olivadese; S. Grivet-Talocia (2012)
Compressed Passive Macromodeling. In: IEEE TRANSACTIONS ON COMPONENTS, PACKAGING, AND MANUFACTURING TECHNOLOGY, vol. 2 n. 8, pp. 1378-1388. - ISSN 2156-3950
Web of Science: 4 - Scopus: 3
[img]
Preview
[img]

Articolo di rivista Vande Ginste D.; De Zutter D.; Deschrijver D.; Dhaene T.; Manfredi P.; Canavero F.G. (2012)
Stochastic Modeling-Based Variability Analysis of On-Chip Interconnects. In: IEEE TRANSACTIONS ON COMPONENTS, PACKAGING, AND MANUFACTURING TECHNOLOGY, vol. 2 n. 7, pp. 1182-1192. - ISSN 2156-3950 [Disponibilità ristretta]
Web of Science: 44 - Scopus: 57
[img]

Articolo di rivista Stievano I.S.; Rigazio L.; Maio I.A.; Canavero F.G. (2011)
Behavioral modeling of IC core power-delivery networks from measured data. In: IEEE TRANSACTIONS ON COMPONENTS, PACKAGING, AND MANUFACTURING TECHNOLOGY, vol. 1 n. 3, pp. 367-373. - ISSN 2156-3950
Web of Science: 2 - Scopus: 3
[img] [img]
Preview

Articolo di rivista Chinea A.; Grivet-Talocia S. (2011)
On the Parallelization of Vector Fitting Algorithms. In: IEEE TRANSACTIONS ON COMPONENTS, PACKAGING, AND MANUFACTURING TECHNOLOGY, vol. 1 n. 11, pp. 1761-1773. - ISSN 2156-3950
Web of Science: 12 - Scopus: 10
[img]
Preview
[img]

Articolo di rivista Stievano I.S.; Manfredi P.; Canavero F.G. (2011)
Parameters Variability Effects on Multiconductor Interconnects via Hermite Polynomial Chaos. In: IEEE TRANSACTIONS ON COMPONENTS, PACKAGING, AND MANUFACTURING TECHNOLOGY, vol. 1 n. 8, pp. 1234-1239. - ISSN 2156-3950
Web of Science: 52 - Scopus: 63
[img]
Preview
[img]

Articolo di rivista Chinea, A.; Grivet-Talocia, S.; Hu, H.; Triverio, P.; Kaller, D.; Siviero, C.; Kindscher, M. (2011)
Signal Integrity Verification of Multichip Links Using Passive Channel Macromodels. In: IEEE TRANSACTIONS ON COMPONENTS, PACKAGING, AND MANUFACTURING TECHNOLOGY, vol. 1 n. 6, pp. 920-933. - ISSN 2156-3950
Web of Science: 11 - Scopus: 12
[img] [img]
Preview

Articolo di rivista Loggia V., Grivet-Talocia S., Hu H. (2011)
Transient Simulation of Complex High-Speed Channels via Waveform Relaxation. In: IEEE TRANSACTIONS ON COMPONENTS, PACKAGING, AND MANUFACTURING TECHNOLOGY, vol. 1 n. 11, pp. 1823-1838. - ISSN 2156-3950
Web of Science: 9 - Scopus: 11
[img]
Preview
[img]

Articolo di rivista Cunha, T.R.; Teixeira, H.M.; Pedro, J.C.; Stievano, I.S.; Rigazio, L.; Canavero, F.G.; Izzi, R.; Vitale, F.; Girardi, A. (2011)
Validation by Measurements of a IC Modeling Approach for SiP Applications. In: IEEE TRANSACTIONS ON COMPONENTS, PACKAGING, AND MANUFACTURING TECHNOLOGY, vol. 1 n. 8, pp. 1214-1225. - ISSN 2156-3950
Web of Science: 5 - Scopus: 7
[img]
Preview
[img]

Questa lista è stata generata il Fri Nov 17 06:32:10 2017 CET.